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60 SMT007 MAGAZINE I SEPTEMBER 2018 objects. In addition to the orthogonal camera, Viscom camera modules integrate up to eight angled-view cameras. This results in true- to-life accuracy for the display of individual components. A very high image acquisition speed for this nine-directional and virtually shadow free 3D reconstruction approach is kept by sophisticated Viscom-developed image acquisition hardware. The use of 3D tech - nologies will increase in general. More and more customers want to use X-ray systems to inspect concealed solder joints and acknowl- edge the advantages of 3D technology (planar CT) here as well. Las Marias: What are some of the challenges being faced by your customers, and how are you helping address them? Krippner: High-performance manufacturing of advanced electronics depends on complex auto- matic processes where many different equip- ment suppliers are involved. Generally accepted cr oss-manufacturer standards will help our customers to enhance technological integra - tion and interaction. Recently, there has been an increase in collaboration here and Viscom is part of it. Whether it be the Hermes Standard as a European initiative or IPC's CFX (Connected Factory Initiative) in the United States, it is clear to everyone in the industry that such cooper - ation produces added benefits. With its Open Interface 4.0 for connecting third-party systems to the AOI/AXI verification station, Viscom has also contributed independently to open stan- dards. Las Marias: What can you say about the future of inspection, including AOI, AXI, and SPI? Krippner: In system technology, a certain main- stream can be observed and from my point of view it will be primarily in software, where the greatest competitive pressure will arise in the future. Here, individual creativity is required, and competition will produce the best solu- tions for customers. Las Marias: Do you have any final comments? Krippner: Our customers need us to be at the forefront of technological development so that we can help them significantly to master future challenges. There is a great emphasis at Viscom on continuous research and devel- opment. But it is also through close customer relations that Viscom products become highly competitive. For us, it is very important to be in direct contact with technical management and system operators of electronics manufacturers worldwide. One of our strengths is to provide individually customized solutions, which after successful implementation become part of our long-term experience. Las Marias: Great. Thank you very much! Krippner: Thank you! SMT007 Alpha Assembly Solutions has been working on low- temperature soldering using tin-bismuth alloys for several years now. Recently, they have launched a new solder technology that they expect will revolutionize the use of low-temperature soldering. In an interview with I-Connect007, Morgana Ribas discusses the new low-temperature solder technology that she has developed at Alpha, and how this will impact the PCB assembly industry. Read the interview here. Read Alpha's low-temperature soldering book. Alpha's Revolutionary Approach to Low-Temp Soldering

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