Issue link: https://iconnect007.uberflip.com/i/1024460
26 PCB007 MAGAZINE I SEPTEMBER 2018 the current panel plating process, a switch to semi-additive processes is required. With these processes being common to IC substrate pro- duction, the resulting HDI boards are becom- ing known as substrate-like PCBs (SLP). A generic process flow for SLP produc- tion based on mSAP techniques is shown in Figure 9. Figure 8: General schematic for the ELIC process flow. Figure 9: Outline schematic for SLP process based on mSAP.