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36 DESIGN007 MAGAZINE I SEPTEMBER 2018 Note: Part 1 of this column appeared in the June 2017 issue of The PCB Magazine and Part 2 appeared in the June 2017 issue of The PCB Design Magazine. For many, the driving force to integrate pas- sive components within the layers of the PCB structure was the need for providing the con- sumer with smaller and lighter products. Once the commercial sector began developing and refining embedded component processes and overcoming quality and reliability issues, the automotive, telecom, aeronautic, and aero- space industries recognized the advantages of embedded passives technology for the follow- ing benefits: • Improved density and functionality • Reduced PCB area and weight • Increased assembly process efficiency • Improved functional performance and reliability Most of the passive components used in elec- tronics are discrete surface mount components configured to mount onto land patterns fur- nished on the surface of a PC board. Design- ers have several choices for providing passive functions in a system design, such as discrete surface-mounted passives, array passives or passive networks, integrated (Rs and Cs) pas- sive devices, and embedded discrete passive components. A growing number of PCB sup- Embedding Components, Part 3: Implementing Discrete Passive Devices Designers Notebook by Vern Solberg, CONSULTANT

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