74 DESIGN007 MAGAZINE I SEPTEMBER 2018
1
Mentor Preparing for Next-Gen
PCB Designers
E
In this interview, Paul Musto, director of mar-
keting for Mentor's Board Systems Division,
explains the company's initiatives aimed at
drawing more students into PCB design. We
also discussed the recent movement of elec
-
trical engineers into PCB layout, the need for
students seeking to become PCB designers, and
some of the ways that young people are already
beginning to revolutionize this industry.
2
Polar Instruments Releases
Updates on Speedstack Tool
E
Polar Instruments released detailed informa-
tion documenting recent changes and improve-
ments to their Speedstack tool for rigid PCB
layer stackup design and documentation. Polar
Instruments claims that Speedstack PCB stackup
design tool slashes stack creation time to a frac
-
tion of that taken by traditional methods, reduc-
ing the chances of miscommunication with PCB
manufacturers and the supply chain.
3
Pulsonix Version 10.0 Features
3D PCB Design
E
The latest release of Pulsonix expands its prod-
uct portfolio with intelligent interactive edit-
ing within the 3D design environment. By
enabling the co-design of the PCB within the
2D PCB and 3D environments, Pulsonix short-
ens the time to market with a more productive
workflow and reduces costly errors.
4
Chuck Bauer Discusses the
Future of Packaging
E
When we decided to cover the
future of PCB packaging, we
knew we would have to inter-
view Charles Bauer, Ph.D.,
owner of TechLead Corpora-
tion. Chuck recently spoke
with Happy Holden, Andy Shaughnessy and
Barry Matties about current trends in packag-
ing, the need for product designers and manu-
facturers to communicate, and why no matter
how cool the technology is, cost is still king.
Recent Highlights from Design007