SEPTEMBER 2018 I DESIGN007 MAGAZINE 75
5
Zuken and Polar Instruments
Collaborate to Achieve
Design Consistency
E
CR-8000 Design Force users can now exchange
pre-layout stackup designs seamlessly with
Polar's Speedstack for IC Packaging and PCB
design. The stackup can be validated in Zuken's
DFM Center before release to manufacturing.
6
The Impact of PCB Dielectric
Thickness on Signal Crosstalk
E
This article studies the
impact of dielectric thick-
ness on crosstalk for trans-
mission lines in single-
ended and differential mode
on outer (microstrip) and
inner (stripline) PCB lay-
ers. Crosstalk analysis is performed in 2D
simulation and S-parameters are subsequently
observed.
7
BGA Fanout Routing
Overview
E
PCB developers are deluged with new chal-
lenges caused by increasing density and
smaller components. Ball grid arrays (BGAs)
create particular challenges during layout, with
hundreds of connections in just a few square
centimeters. Fortunately, designers now have
options for addressing these issues.
8
Occam Prize Competition for
Electronic Design Now
Accepting Entries
E
The first annual Occam Prize International
Design Competition has begun accepting reg-
istrations from circuit designers from around
the world. Cash prizes totaling $5,000 will be
awarded to top designers in the inaugural year
of the planned annual competition.
9
In With the New
at Cadence
E
For our issue on the disappear-
ing designer, I recently inter-
viewed Cadence's Dan Fern-
sebner, a veteran EDA guy, and
Bryan LaPointe, who repre-
sents the younger generation.
They discussed the next generation of PCB
designers, some of the best ways to draw smart
young people into this industry, and why the
PCB designers of the future may need to have
a college degree just to get an interview.
J
Beyond Design:
It's a Material World
E
Years ago, when clock fre-
quencies were low and sig-
nal rise times were slow,
selecting a dielectric mate-
rial for your PCB was not dif-
ficult; we all just used FR-4.
And we didn't really care
about the properties of the materials. How-
ever, with today's multi-gigabit designs and
their extremely fast rise times and tight mar-
gins, precise material selection is crucial to the
performance of the product.
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