SMT007 Magazine

Solder Fortification ® Preforms ©2018 Indium Corporation QFN Edge Connector Through-hole RF Shielding • Increase solder volume to strengthen solder joint • Improve shape and volume of fillet to ensure joints meet IPC specifications • Eliminate costly, time-consuming processes • Packaged in tape & reel to maximize pick rate Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/SMTUF Contact us for the Solder Fortification ® Design Guide Click our video for more:

• Cover
• Featured Content — CFX
• Additional Content
• Column — CFX: The Data Train is Now 'Boarding'
• Video Interview — Mycronic Discusses Industry 4.0
• Feature Interview — CFX: Building the Foundation for Industry 4.0
• MilAero007 Highlights
• Feature Column — The Truth About CFX
• Video Interview — Rehm Sees Growing Demand for Vacuum Soldering
• Supplier Highlights
• Feature Interview — Understanding the Benefits of CFX
• Short — The Hermes Standard Becomes IPC-HERMES-9852
• Electronic Industry News and Market Highlights
• Feature Column — Are You Connected to Realiability?
• Short — Study Demonstrates New Mechanism for Developing Electronic Devices
• Feature Interview — Challenges and Opportunities with CFX
• Short — KAIST Develops VRFB with Longer Durability
• Column — Do's and Don'ts of Thermal Management Materials
• Short — Photonic Chips Harness Sound Waves to Speed Up Local Networks
• Article — Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications
• Short — Using Donut-shaped Lithium Sulfide for Higher Performing Batteries
• Top 10 Recent Highlights from SMT007.com
• Career Opportunities
• Events Calendar
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