Issue link: https://iconnect007.uberflip.com/i/1035071
72 SMT007 MAGAZINE I OCTOBER 2018 Test Method To measure and quantify the voiding perfor- mance of the varying pastes and LED pad layouts, the assembled and reflowed boards were loaded into an X-ray analysis unit and programmed to quantify the area of each void as a percent of the total pad area and the number of voids under the package. RESULTS AND DISCUSSION Results The results of this study are shown in Figure 4. Table 4: Reflow profile used in study. Figure 3: Reflow profile, visual depiction. Figure 4: Percent voiding versus LED package design.