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OCTOBER 2018 I SMT007 MAGAZINE 79 Test Method To measure and quantify the void- ing performance an X-ray analysis unit was programmed to quantify the area of each void as a percent of the total pad area and the number of voids under the package. Figure 12 shows the areas under study. RESULTS AND DISCUSSION Results The results of this study are shown in Figure 13 and Table 8. Figure 11: Reflow profile, visual depiction. Figure 12: X-Ray image of soldered ceramic-based LED package.