Design007 Magazine

C e r a m b u s T e c h n o l o g y G r o u p WHAT DO ALL OF THESE LEADING COMPANIES HAVE IN COMMON? Should your name be on the leaders' list? They all benefi t by advertising with us–PCB007 China Magazine.

• Data Design Bottleneck
• Featured Content — Design Data Packages
• Additional Content
• Column — Despite Progress, Design Data Issues Continue
• Short — New Half-Light Half-Matter Particles May Hold the Key to a Computing Revolution
• Feature Interview — Steph Chavez: Breaking the Design Data Bottleneck
• Short — Medication You Can Wear
• Feature Column — Getting on the Same Page: A Data Story
• Short — Superconducting at the Speed of Light
• Feature Interview — At GreenSource, Lean and Green Starts on the Front End
• Short — Novel Topological Insulator
• Feature — Design Data: File Naming Conventions
• Feature Column — Digital Specs for Automated Manufacturing: Find the Missing Link!
• PCB007 Highlights
• New Column — New Landing Design to Reduce Thermal Pad Failures
• Column — 10 Fundamental Rules of High-speed PCB Design, Part 2
• Short — New NIST Method Measures 3D Polymer Processing Precisely
• Column — Embedding Components, Part 4: Passive Component Selection and Land Pattern Development
• Column — Different Aspects of Impedance for PCBs
• MilAero007 Highlights
• Article — New Designers Council Column: The Digital Layout
• Article — Impact of Serpentine Routing on Multi-gigabit Signal Transmission
• Top 10 Recent Highlights from Design007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007: subscribe and contact information