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86 PCB007 MAGAZINE I NOVEMBER 2018 = 93%, TP knee = 86.7% for 0.15-mm TH in a 0.8-mm panel, and AR = 5.3. A high-flow volume setting (0.8L/nozzle per minute) was recommended to achieve good via fill without void defects for high-AR blind vias. Plating of larger vias, 4 x 4.5 mils and 5 x 5.5 mils, is demonstrated in Figure 16: surface plating thickness 0.85-0.9 mils (21–22.5 mm), dimple <0.5 mil (12.5 mm). The operating electrolyte is stable, has an extremely long life, and no secondary breakdown product that ad- versely affects via filling was accumulated in the bath. Plating is consistent across the plated boards (Figure 17). Through-Via-Hole Copper Filling Application In the manufacturing of multi-function- al electronic products, the fabrication of ad- vanced PCBs with HDI is essential. Copper electrodeposition is particularly beneficial to fill through vias in core layers of HDI and IC package substrate. The results from the Pro- cess A optimization were used further in devel- oping a process for filling through microvias. The interaction of organic additives as previ- ously discussed is critical in determining the Figure 15: Plating with soluble anodes. Figure 16: 650L tank, 0.7L/nozzle*min (20 ASF for 65 minutes). Figure 17: Soluble anodes (22.4 ASF for 12 minutes plus 16 ASF for 48 minutes).