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92 SMT007 MAGAZINE I DECEMBER 2018 1 One World, One Industry: Back to School with IPC EDGE 2.0 E IPC spent the summer gear- ing up for new education and certification platforms, and has announced that IPC EDGE 2.0 is ready for all certification users. John Mitchell talked with David Hernandez, senior director of learning and professional develop - ment, and Kris Roberson, director of certifi- cation programs, to talk about what's new in education and certification. 2 A Brief History of Solder Stencil Manufacturing E Greg Smith, manager of stencil technology at BlueRing Stencils, made his first SMT stencil in the 1980s. In this new column, SMT Sten- cils 101, Greg will discuss the fundamental concepts and principles in surface-mount tech- nology (SMT) stencils, beginning with a bit of a history, and the latest developments and technologies in stencils. 3 Alpha Preforms Improve Thermal Management on BTCs E Alpha Assembly Solutions has recently intro- duced ALPHA AccuFlux BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTCs). 4 Low-temperature Solder Paste Process Advantages E This article examines the performance of two low melting point SnBi alloys used in solder paste when assembling BGA compo- nents with SAC alloy spheres, and the advan- tages of a low-temperature process over the regular SAC assembly process. It will also evaluate solder paste capability regarding the process and the performance of a joint formed with a low melting point alloy solder paste and SAC305 spheres, including process advantages and material capabilities. Editor's Picks from John Mitchell

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