92 SMT007 MAGAZINE I DECEMBER 2018
1
One World, One Industry: Back to
School with IPC EDGE 2.0
E
IPC spent the summer gear-
ing up for new education and
certification platforms, and
has announced that IPC EDGE
2.0 is ready for all certification
users. John Mitchell talked
with David Hernandez, senior
director of learning and professional develop
-
ment, and Kris Roberson, director of certifi-
cation programs, to talk about what's new in
education and certification.
2
A Brief History of Solder Stencil
Manufacturing
E
Greg Smith, manager of stencil technology at
BlueRing Stencils, made his first SMT stencil
in the 1980s. In this new column, SMT Sten-
cils 101, Greg will discuss the fundamental
concepts and principles in surface-mount tech-
nology (SMT) stencils, beginning with a bit
of a history, and the latest developments and
technologies in stencils.
3
Alpha Preforms Improve Thermal
Management on BTCs
E
Alpha Assembly Solutions has recently intro-
duced ALPHA AccuFlux BTC-578 Solder
Preforms, designed to enhance reliability and
heat transfer through the reduction of voiding
under bottom termination components (BTCs).
4
Low-temperature Solder Paste
Process Advantages
E
This article examines the
performance of two low
melting point SnBi alloys
used in solder paste when
assembling BGA compo-
nents with SAC alloy
spheres, and the advan-
tages of a low-temperature
process over the regular SAC assembly process.
It will also evaluate solder paste capability
regarding the process and the performance of
a joint formed with a low melting point alloy
solder paste and SAC305 spheres, including
process advantages and material capabilities.
Editor's Picks from SMT007.com
John Mitchell
