Cu wire
PallaBond
®
is an environmentally friendly process suitable for high frequency
and fine L/S applications. The process provides very good bonding capability
with aluminum-, gold-, silver-, copper- and copper-palladium-wires.
Further outstanding is its good solder joint reliability.
Thanks to its very mild process conditions, it provides excellent compatibility
with base materials and soldermasks. It also consumes less energy and
water than ENIG, ENEPIG and immersion tin finishes.
Bio compatible pure
palladium ideal for
medical application
atotech.com Global head office
Atotech Group
+49 30 349850
info@atotech.com
PallaBond
®
IMC investigation
0.1 μm Pd / 0.1 μm Au
Top view: copper-wire
20 μm on EPAG finish
Direct pure EPAG for
ultra fine L/S applica on
Premium wire bonding and soldering
capability
