5 µm
atotech.com Global head office
Atotech Group
Neal Wood
neal.wood@atotech.com
BondFilm
®
EX
Low signal loss with high
frequency applica ons
Bonding enhancement solu on
Excellent bonding performance with low etch depth with key low
loss materials
High frequency applications need a bonding enhancement process that
gives excellent thermal reliability and provides additionally superior
performance in terms of reduced signal loss. BondFilm
®
EX is an advanced
replacement for conventional bonding enhancement solutions, offering
enhanced performance with minimal copper removal and therefore a
smooth copper interface desired for high frequency applications without
the need to revert to more complex NEAP applications.
2 µm
9
8
7
6
5
4
3
2
1
0
Peel
strength
(N/cm)
ED: 0.3 μm ED: 0.5 μm
Peel strength on Panasonic R-5670 (M6)
Ini al
A er 6x reflow
