Issue link: https://iconnect007.uberflip.com/i/1069358
46 PCB007 MAGAZINE I JANUARY 2019 technology? As you said, since this is 3D, this is a whole new dimension to our planar, flat world of things that people will probably think is exciting, but how do we go about doing it? Bernards: MIDs are largely used in the mobile devices industry right now for antennas or connecting electronics through parts of the casing. In that case, they don't really require a highly ductile copper deposit. The environment isn't quite as harsh and the product life cycle is comparatively short. We will be establishing best practices for how to apply this technology including where it is and is not suitable. We feel that the adaptation of the automotive industry to the MID will open up many new opportunities which might require extra reliability; it's going to be something that we're going to have to learn and work on together. The automotive industry has already adapted MID for a few applications; however, certain applications requiring higher reliability have not been attempted yet. This is going to be something new for them, and we will have to address all of the issues that come up together with our automotive supply-chain partners. Holden: Does MacDermid Alpha supply the catalyst? Bernards: No, it's something that's embedded into the plastic way upstream. We don't sell this catalyst; it's a copper chromite particle that's mixed in with the mold when the parts are molded. It's already there. Holden: Is that an established technology with different plastics? Bernards: Yes, it is. For different plastics like ABS and various other kinds of plastics. The catalyst has come a long way in the last five or six years. It used to be that they had a lot of issues with just getting the electroless copper to plate onto the catalyst, but they have improved the process quite a bit. It's not typically an issue to achieve plating with the catalyst, so there have been a lot of improvements in that. It's an upstream process that MacDermid Alpha is not involved in. Holden: Are they using expensive metal like palladium in the catalyst? Bernards: No, it's copper chromite. Palladium was used in the older two-shot processes many years ago when MIDs were made in a different manner. The copper chromite is a different animal, but with the initiation of the electroless onto it, you still need to have a bath that is properly formulated to initiate onto that catalyst. However, that's not a big roadblock right now. Holden: Where do you think this technology can go in terms of future applications other than what we've shared? Bernards: I think it could also be used for a lot of applications including flex circuits and fine- line flex circuitry perhaps where you'd want to have a full-build process, and your limitation is that you can't do any etching because of risk of undercutting; basically, very fine-line fully additive processing. I think it's suitable for anything where you'd want to use that kind of technology, including SAP panels where you want to have a full-build additive process to eliminate etching and undercutting, which allows you to squish lines and spaces much closer together. Holden: I'm glad you could take the time to enlighten us on this. Thank you, Roger. Bernards: Thank you very much. PCB007 We will be establishing best practices for how to apply this technology including where it is and is not suitable.