JANUARY 2019 I FLEX007 MAGAZINE 41
Ventec Expands ThinFlex Inventory
in Europe E
Ventec International Group Co., Ltd. is expand-
ing its ThinFlex inventory to multiple Euro-
pean locations with full cutting capability in
both Germany and the UK.
All Flex Expands Rigid-Flex Capabilities
with Pluritec X-ray Drill/Rout Optimizer E
All Flex purchases new Pluritec Inspecta HPL
X-Ray Drill/Rout Optimizer & two EVO-2S
Automated drill/rout systems to expand rigid-
flex capabilities.
IPC Executive Forum on Advancing
Automotive Electronics E
The forum features such worldwide notables
as Dr. Udo Welzel, team leader of automotive
electronics, engineering assembly and inter-
connect technology at Robert Bosch GmbH,
who will present "Enabling Connected, Elec-
trified and Automated Mobility: Challenges for
Assembly and Interconnect Technology."
Nano Dimension Partners with
Productivity Inc.; Expands Reseller
Network E
Nano Dimension announced a new reseller
agreement with Productivity Inc., significantly
expanding the company's North American
channel partner ecosystem.
Flexible Electronics Market to Witness
Enhanced Application E
The global flexible electronics Market is esti-
mated to touch $87.21 billion by the comple-
tion of the prediction period. It is estimated to
develop at a substantial CAGR for the duration
of the prediction.
FLEX 2019 and MSTC to Highlight
MedTech, Transpo and IoT E
Flexible and printed electronics innovations
and autonomous mobility sensors will take
center stage as more than 700 attendees gather
for 120 market and technical presentations,
70 exhibits and four short courses at the co-
located FLEX 2019 and MEMS & Sensors Tech-
nical Congress (MSTC) in Monterey, Califor-
nia, February 18-21, 2019.
Amphenol Invotec Reaffirms Status
as an ESA-Approved Supplier E
Amphenol Invotec, a leading European man-
ufacturer of advanced PCBs, is pleased to
announce that it has successfully extended its
European Space Agency (ESA) qualification
for the supply of sequential rigid polyimide
boards to November 2020.
IDTechEx Highlights World Firsts in
Printed Electronics in 2018 E
With the end of the year in sight, it's interest-
ing to look back and review what has been
new in the world of printed electronics in the
last 12 months. This analysis is taken from
the new IDTechEx Research report, "Flexible,
Printed and Organic Electronics 2019-2029"
covering the entire sector in great detail,
based on analyzing the industry for over 15
years.
Challenges in Flex Circuit
Assembly E
In a recent I-Connect007 survey on flex cir-
cuits, we asked the following question: What
are some of the challenges that you face uti-
lizing flex circuits? Here are just a few of the
replies, edited slightly for clarity.
