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Consistency Drives the Value Affinity ENIG 2.0, when used with MultiPrep 200, delivers the best of both worlds: unmatched ENIG consistency and ultra strong soldermask adhesion. AFFINITY 2.0 www.macdermidalpha.com ELECTROLESS NICKEL / IMMERSION GOLD Affinity Process Variation gold thickness (microinches) MULTIPREP 200 FOR ULTIMATE SOLDERMASK ADHESION Traditional brush scrub and commodity copper etch result in a copper-to-soldermask bond that's vulnerable to harsh ENIG chemistry and temperatures. Engineered copper texturing, provided by MultiPrep 200, paired with the unrivaled process control of Affinity 2.0, produce a superior soldermask interface. + electronics.macdermidenthone.com

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