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REAL TIME WITH... IPC APEX EXPO 2019 SHOW & TELL MAGAZINE I I-CONNECT007 111 voiding can be checked quickly and easily on a high mix of product types across a PCB. Henkel Corporation for its LOCTITE ECCO- BOND UF 1173—a novel underfill that can withstand harsh environments and the elevated operating temperatures inherent with smaller, higher-functioning devices. In addition to its performance benefits, the product prioritizes health and safety. Vayo (Shanghai) Technology Company Ltd. for its DFM Expert v5—a unique 3D DFA/DFM solution for electronics manufacturing. "The IPC APEX EXPO Innovation Awards allow us to celebrate the innovators and forward think- ers who are changing the technological land- scape of the electronics industry," said Dr. John Mitchell, IPC president and CEO. "This year, product and service submissions were certainly innovative, and the companies did an excep- tional job in identifying their product's unique value in the industry. The innovative submis- sions directly indicate the strength of the elec- tronics industry and its ability to respond to new challenges resulting from emerging technologies in the electronics marketplace," Mitchell added. Members of the award review board include Dave Geiger, Flex; Don Dupriest, Lockheed Mar- tin Missiles and Fire Control; Carsten Salewski, Viscom Inc.; Martin Goetz, Northrop Grumman Corporation; and Terry Kocour, Lockheed Mar- tin Corporation. S&T

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