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150 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2019 SHOW & TELL MAGAZINE IPC Issues Call for Participation for IPC APEX EXPO 2020 Submit an abstract for one of the industry's premier technical conferences or provide a course proposal for one of its largest educational events. Presenting at IPC APEX EXPO 2020 in San Diego, California, will provide significant visibility for you and your company. Thousands of individuals will receive the technical pro - ceedings of the conference, ensuring that your published paper will be seen by key engineers, managers, and executives from all segments of the worldwide electronic interconnection indus - try. Presenting a technical conference paper or teaching a professional development course is a unique and cost-effective channel to promote your expertise and your organization to your customers, prospects, and the industry. Topics for technical conference papers and professional development courses include: • 3D Printing in Electronics Manufacturing • Automation in Electronics Manufacturing • Adhesives • Advanced Technology • Area Array/Flip Chip/0201 Metric • Assembly and Rework Processes • BGA/CSP Packaging • Black Pad and Other Board Related Defect Issues • BTC/QFN/LGA Components • Business & Supply Chain Issues • Cleaning • Conformal Coatings • Corrosion • Counterfeit Electronics • Design • Electromigration • Electronics Manufacturing Services • Embedded Passive & Active Devices • Environmental Compliance • Graphene in Electronics Manufacturing • Lean Six Sigma • LED Manufacturing • Failure Analysis • Flexible Circuitry • HDI Technologies • Head-on-Pillow • Board and Component Warpage • High Speed, High Frequency & Signal • Industry 4.0 • Integrity • Lead-Free Fabrication, Assembly & Reliability • Miniaturization Nanotechnology Optoelectronics • Packaging & Components • PCB Fabrication • PCB and Component Storage & Handling Performance • Quality & Reliability • Photovoltaics • PoP (Package-on-Package) • Printed Electronics • Reshoring • RFID Circuitry • Robotics • Soldering • Surface Finishes • Test, Inspection & AOI • Tin Whiskers • 2.5-D/3-D Component Packaging • Underfills • Via Plugging & Other Protection • Wearables Technical Conference Submission Requirements Provide an abstract of approximately 300 words that summarizes technical work, cover- ing case histories, research, and discoveries. Authors of papers selected for the conference will each receive a detailed speaker manual to assist them with numerous items including the formatting of their papers and presentation slides. The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to properly assess the content of the proposed paper. The paper should be noncommercial and describe significant results from experiments, empha-

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