Issue link: https://iconnect007.uberflip.com/i/1083315
REAL TIME WITH... IPC APEX EXPO 2019 SHOW & TELL MAGAZINE I I-CONNECT007 55 Lionel Fullwood is a technical director at WKK Distribution Ltd. in Hong Kong and is respon- sible for research and development of new products and processes and technical problem resolution for clients. He has presented numer- ous technical papers and is involved with more than a dozen IPC standards development com- mittees including chairing the Design Commit- tee and D-31 Rigid Printed Board Design Sub- committee. In 2003, Fullwood was presented with an IPC President's Award, and in 2013, an IPC Hall of Fame Award for his contributions to IPC and the electronics industry. He holds a B.S. degree in chemistry from Brigham Young Uni- versity in Provo, Utah, and a master's degree in molecular biology and polymer chemistry from the University of California, Irvine. Patty Goldman: First of all, Lionel, congratula- tions on receiving the Dieter Bergman Fellow- ship Award. First, could you give us a little background about yourself? Lionel Fullwood: Well, here's the short version (laughs). I was born in Liverpool, England, during the bombings of World War II, shipped up to Scotland, and spent the first few years of my life there. Then, I went back to Liver- pool until I was 18, and came to America for school. I got involved with PCBs in the military in 1963 with Autonetics in Anaheim, Califor- nia—a division of North American Aviation— and we made the guidance systems for min- utemen—two and three Polaris and Poseidon submarines. I just fell in love with the tech- nology. Finished my undergraduate work at Brigham Young University in Provo, Utah, in chemistry, I did my graduate work at the Uni- versity of California—Irvine in biochemistry, organic chemistry, and ended up in chemical engineering. Since '63, I've been in PCBs, and from 1982 until 2017, I was in Asia. Goldman: Since '82. Wow, that's 35 years in Asia. Lionel Fullwood, Long-time IPC Member and Contributor 1