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FEBRUARY 2019 I DESIGN007 MAGAZINE 65 Further Reading 1. Coonrod, J. "Circuit materials and high- frequency losses of PCBs," The PCB Magazine, February 2012. 2. Henninger, T. "PCB Surface Finishes," Viasystems presentation. 3. Olney, B. "Effects of Surface Roughness on High-speed PCBs," The PCB Design Magazine, February 2015. Chang Fei Yee is a hardware engineer with Keysight Technologies. His responsibilities include embedded system hardware development, and signal and power integrity analysis. depicted in Figure 3 indicate that metal plating or coating on top of the copper trace reduces the single-ended characteristic impedance by 1 ohm versus Model A (i.e., bare copper without plating). Summary For the fabrication of PCBs with high-fre- quency signal routing beyond 5 GHz, the selec- tion of metal plating is very important. Besides degradation due to oxidation, hardware design- ers should also consider the skin effect and attenuation contributed by the conductivity of the plating material. DESIGN007 Figure 2: S21 plots for models listed in Table 2. Figure 3: TDR plots for models listed in Table 2. In an interview with I-Connect007 Technical Editor Pete Starkey, Robert Art, global account manager for IMS materials at Ventec International Group, discusses future market re- quirements for thermal management materials, and the need for a better understanding of the concept of thermal impedance. "The market is looking for what it has always looked for—better thermal performance. In every sales meeting and discussion with customers and at trade show events, the engineering community is always looking for better thermal performance. We continue to push the envelope when it comes to developing stronger, more reliable robust Robert Art on the Importance of Thermal Management dielectrics that can be thinner to reduce thermal imped- ance and resistance values," says Art. Another topic in discussion was solder joint reliability. Art noted that solder joint reliability is a big concern today for many customers, and not exclusive to the automotive electronics market. "If you look at our roadmaps, some of the product offerings we're pursuing not only improve the thermal performance or peel strength but also the modu - lus of the dielectric to make it more conducive to provid- ing a solid solder joint. Solder joint fatigue is a big issue in our marketplace today, and that's an area of focus for our future development," said Art. To read the full interview, click here. (Source: I-Connect007)

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