Design007 Magazine
Design007-Feb2019
Issue link:
https://iconnect007.uberflip.com/i/1085192
Contents of this Issue
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Articles in this issue
Cover: Where Everything's a Substrate
Featured Content — Everything's a Substrate
Additional Content
Column — The Future on Display at DesignCon
Feature Column — Not All PCB Substrates Are Created Equal
Feature Interview — Dan Gamota Discusses Flex and Alternative Substrates
Feature Column — Microwave PCB Bonding Methods: What Designers Need to Know
Short — Circuit Design May Boost Memory Storage
Feature Column — Higher Frequencies Pave Way for Flexible Circuit Materials
Short — Neutrons: Fueling Better Power
PCB007 Highlights
Column — Eliminate Confusion
Column — Greater Phoenix Chapter Revived
Column — Exploding PCBs: Don't Lose Track of Voltage in Your Design
Short — Fraunhofer and Forming Technology IWU Develop Interactive Control for Industrial Robots
Column — Thermal Management Materials: Golden Rules for Product Selection
Short — AI Instantly Captures Materials' Properties
MilAero007 Highlights
Article — 3DEM Modeling: Influence of Metal Plating on PCB Channel Loss and Impedance
Short — Robert Art on the Importance of Thermal Management
Top 10 Editor Picks from PCBDesign007
Career Opportunites Section
Events Calendar
Advertiser Index and Masthead
I-Connect007 Subscription and Contact Information
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