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MAY 2019 I SMT007 MAGAZINE 13 yield strength and Bi volume fraction as a result of the transition of the strengthening mecha- nism. Bi must be used properly to eschew any likely adverse effects in the reliability of solder joint, which may lead to likely product failure. To utilize the benefits that Bi can offer in forming electronic solder interconnections, a specified dosage in a specific alloy compo- sition system is required; the knowledge of its intricate interplay with other constituents in an alloy composition is indispensable. An understanding of the design-for-performance demands as well as application constraints is also a prerequisite. Overall, the concentration of Bi in solder joint has to be carefully designed. Unfortunately, many studies and testing programs with an intent to compare Bi-containing alloys with a Bi-absent solder alloy have often selected a Bi dosage apart from what is required or desired. This lack of proper composition (a proper Bi dosage in a specific system) has contributed to highly publicized negative test results. Thus, this has impeded the application of Bi in Sn- based solder alloy systems during the first decade of deployment of lead-free solder inter- connecting materials for producing electronic products. SMT007 References 1. H-Technologies Group Inc. "Internal Reports," 1990– 1999. 2. Hwang, J. "Lead-free Implementation Series, Part 6—The Role of Bismuth," IPC Professional Development Courses, 1999–2010. 3. Hwang, J. Environment-friendly Electronics—Lead- free Technology, "Chapter 28: The Role of Bismuth," Elec- trochemical Publications Ltd., Great Britain, 2001. 4. Hwang, J. Environment-friendly Electronics—Lead- free Technology, Electrochemical Publications Ltd., Great Britain, 2001, p. 758. Dr. Jennie S. Hwang— an interna- tional businesswoman and speaker, and business and technology advi- sor—is a pioneer and long-standing contributor to electronics hardware manufacturing as well as to the envi- ronment-friendly lead-free electronics implementation. Among her many awards and honors, she was inducted to the International Hall of Fame—Women in Technology, elected to the National Academy of Engineering, an R&D- Stars-to-Watch, and YWCA Achievement Award. Hav - ing held senior executive positions with Lockheed Martin Corp., Sherwin Williams Co., SCM Corp, and CEO of Inter- national Electronic Materials Corp., she is currently CEO of H-Technologies Group providing business, technology and manufacturing solutions. She is the Chairman of Assess- ment Board of DoD Army Research Laboratory, serving on Commerce Department's Export Council, National Materi- als and Manufacturing Board, Army Science and Technol- ogy Board, various national panels/committees, interna- tional leadership positions, and the board of Fortune-500 NYSE companies and civic and university boards. She is the author of 500+ publications and several books, and a speaker and author on trade, business, education, and social issues. Her formal education includes four aca - demic degrees as well as the Harvard Business School Executive Program and Columbia University Corporate Governance Program. For more information, please visit To read past columns or contact Hwang, click here. While attending the recent West Penn SMTA Expo, I-Connect's Patty Goldman spoke with Eileen Hibbler, a chapter support specialist at SMTA, and Jason Emes, the current president of the West Penn SMTA Chapter. Despite having an active membership, the local chapter has seen some officer turnover due to job changes and Eileen and Jason were anxious to discuss ways to improve meeting attendance and develop a new slate of chapter officers. To read the interview, click here. (Source: I-Connect007) Eileen Hibbler and Jason Emes on Improving the West Penn SMTA Chapter

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