MAY 2019 I PCB007 MAGAZINE 119
5
AT&S Demonstrates Efficiency
and Robustness of Embedded
Power Technology E
To improve the efficiency in modern cars on
the way to electromobility and in challenging
industrial power conversion applications, the
power density has to be increased without lim-
itations on performance and reliability.
6
The Right Approach: The New
Frontier of Manufacturing E
While M2M and H2M con-
nectivity are the primary fo-
cus of Industry 4.0, the true
underlying benefit of Indus-
try 4.0 comes in the form of
machine-to-business (M2B)
connectivity or the "ma-
chine-as-a-service" concept. This is changing
the way we purchase equipment.
7
The PCB Norsemen: A PCB Broker's
Guide Through the Galaxy
of Automation E
A smart factory is defined
by its ability to harness
manufacturing data flowing
throughout the enterprise
and then convert that data
into intelligent information
that can be used to create
improvements in productivity, efficiency, sav-
ings, yields, automation, enabled traceability,
compliance, and reduced risk of errors and
rework. All of these items are crucial factors
when manufacturing printed circuits.
8
Advance Your Company
Through Automation E
Yash Sutariya discusses with
Patty Goldman the labor short-
age he has experienced in the
Detroit area, the impact auto-
mation can have in the man-
ufacturing process, and other
strategies to advance your company.
9
University Students Point to the
Future in Their Research E
Cutting-edge automation, AI, machine learn-
ing, and Industry 4.0 are all part of the re-
sponse to the increasing demands for printed
circuit boards that are not only faster, smaller,
and cheaper but also higher-frequency, lower-
loss, more temperature tolerant, and higher re-
liability. In many cases, it will be unique and
advanced research coming out of the univer-
sity system that will help move the industry
forward.
J
Stacked Microvia Reliability:
Ongoing Work and Upcoming
IPC Conference E
One year ago, Happy Holden's review of the
2018 IPC High-Reliability Forum reported the
presentation of J.R. Strickland and Jerry Magera
who described research at MSI Applied Technol-
ogy into overcoming the risk of stacked micro-
via failures escaping standard quality assurance
procedures. Their report provided a basis for the
IPC white paper IPC-WP-023, which addressed
reliability issues associated with stacked micro-
vias and included data collected from several
other printed circuit manufacturers.
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Yash Sutariya
Jan Pedersen
Steve Williams
