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144 SMT007 MAGAZINE I JULY 2019 SMTA Ohio Expo & Tech Forum E August 8, 2019 Strongsville, Ohio, USA The 20 th International Conference on Electronic Packaging Technology E August 11–15, 2019 Hong Kong NEPCON South China 2019 E August 28–30, 2019 Shenzhen, China SMTA International 2019 E September 22–26, 2019 Rosemont, Illinois, USA productronica India 2019 E September 25–27, 2019 Delhi NCR, India electronica India 2019 E September 25–27, 2019 Delhi NCR, India 52 nd International Symposium on Microelectronics E September 29–October 3, 2019 Boston, Massachusetts, USA productronica 2019 E November 12–15, 2019 Munich, Germany Events Calendar Coming Soon to SMT007 Magazine: SEPTEMBER: Standards We report on recent developments in current and emerging standards and take a step back to discuss some of the inherent strengths and weaknesses of standards processes. AUGUST: Wet Processes Wet processes are the core of printed circuit fabrication. What's new, and are there any new offerings down the road to make your wet process capabilities sharper? Faster? Greener? Easier to operate? Find out in this issue. Additional Event Calendars

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