144 SMT007 MAGAZINE I JULY 2019
SMTA Ohio Expo & Tech Forum
E
August 8, 2019
Strongsville, Ohio, USA
The 20
th
International Conference
on Electronic Packaging Technology
E
August 11–15, 2019
Hong Kong
NEPCON South China 2019
E
August 28–30, 2019
Shenzhen, China
SMTA International 2019
E
September 22–26, 2019
Rosemont, Illinois, USA
productronica India 2019
E
September 25–27, 2019
Delhi NCR, India
electronica India 2019
E
September 25–27, 2019
Delhi NCR, India
52
nd
International Symposium
on Microelectronics
E
September 29–October 3, 2019
Boston, Massachusetts, USA
productronica 2019
E
November 12–15, 2019
Munich, Germany
Events Calendar
Coming Soon to SMT007 Magazine:
SEPTEMBER: Standards
We report on recent developments in current and
emerging standards and take a step back to discuss
some of the inherent strengths and weaknesses of
standards processes.
AUGUST: Wet Processes
Wet processes are the core of printed circuit fabrication.
What's new, and are there any new offerings down the road
to make your wet process capabilities sharper? Faster?
Greener? Easier to operate? Find out in this issue.
Additional Event Calendars
