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4 SMT007 MAGAZINE I JULY 2019 It should come as no surprise that solder and solder joints are often at the center of attention in electronics assembly when discussing failures and reliability. This issue includes articles and columns from industry experts as well as insight- ful technical papers on the cutting-edge of failure and reliability research. Reliability vs. Failure Optimizing Solder Paste Volume for Low-temperature Reflow of BGA Packages by Keith Sweatman Size Matters: The Effects of Solder Powder Size on Solder Paste Performance by Tony Lentz Low-temperature SMT Solder Evaluation by Howard "Rusty" Osgood, et al. Surface Treatment Enabling Low-temperature Soldering to Aluminum by Divyakant Kadiwala Failures and Reliability in Soldering by Michael Gouldsmith and Zen Lee Approaches to Overcome Nodules and Scratches on Wire-bondable Plating on PCBs by Young K. Song, Vanja Bukva, and Ryan Wong FEATURE COLUMNS: Would You Prefer Shorts or Opens in Your Products? by Ray Prasad The F Word by Eric Camden Common Machine Errors and How to Avoid Them by Chris Ellis 14 32 60 76 88 96 28 56 84 JULY 2019 • FEATURED CONTENT 96 32 60

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