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JULY 2019 I SMT007 MAGAZINE 55 smaller solder powder sizes are used, the users should be aware of these performance differ- ences so that the SMT process can be tuned accordingly. Solder paste manufacturers are looking ahead to the future needs of the electronics indus- try. Smaller solder powder sizes are becoming increasingly common for miniaturized elec- tronic applications. Solder paste manufactur- ers are formulating products for use with the smaller solder powder sizes to address these needs. SMT007 References 1. Solder Paste Task Group (5-24b), "Requirements for Soldering Pastes," J-STD-005A, February 2012. 2. Stencil Design Task Group (5-21e), "Stencil Design Guidelines," IPC-7525B, October 2011. 3. T. O'Neill, C. Tafoya, G. Ramirez, "The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance," Proceedings of IPC APEX EXPO, 2016. 4. R. Gray, "Development of a Robust 03015 Process," Proceedings of IPC APEX EXPO, 2015. 5. B. Roggeman, B. Keser, "Improved SMT and BLR of 0.35-mm Pitch Wafer Level Packages," Proceedings of SMTA International, 2015. 6. S. Harter, J. Franke, C. Lantzsch, "Evaluation of the Stencil Printing for Highly Miniaturized SMT Components with 03015 mm in Size," Proceedings of SMTA Interna- tional, 2015. 7. Nobari, S. St-Laurent, "Solder Powder Characteristics and Their Effect on Fine Pitch Printing of Solder Paste," Proceedings of SMTA International, 2017. 8. E. Bastow, "Does Solder Particle Size Impact the Elec- trical Reliability of a No-Clean Solder Paste Flux Residue?" Proceedings of IPC APEX EXPO, 2016. 9. Nobari, S. St-Laurent, "Effect of Fine and Ultra-Fine Lead-Free Solder Powder Characteristics on The Reflow Property of Pastes," Proceedings of SMTA International, 2016. 10. Nobari, S. St-Laurent, "Investigation of Characteris- tics of Lead-Free Powders for Solder Paste Application," Proceedings of IPC APEX EXPO, 2017. 11. Japanese Standards Association, "Japanese Indus- trial Standard Solder Paste," JIS Z 3284, 1994. This paper was first presented at the IPC APEX EXPO 2019 Technical Conference and published in the 2019 Technical Conference Proceedings. Tony Lentz is a chemist/field application engineer with FCT Assembly in Greeley, Colorado, USA. Researchers have pioneered a new technique using pressure to manipulate magnetism in thin-film materials used to enhance performance in electronic devices. They used neutron scattering at Oak Ridge National Laborato- ry's Spallation Neutron Source to explore the spatial den- sity of atoms and observe how magnetism in a lantha- num-cobalt-oxide film changed with applied pressure. "We developed a novel method to identify the critical role that strain has on the magnetism of films and their interfaces," said ORNL's Michael R. Fitzsimmons. "This allows us to study magnetism in thin films without having to compare a lot of differently grown samples." The new technique, described in Physical Review Letters, will enable novel studies into complex correla- tions between magnetism and pressure involving a broad class of thin films in a wide range of applications. The thin-film materials were developed at ORNL, and comple- mentary measurements were made at Argonne National Laboratory's Advanced Photon Source. (Source: Oak Ridge National Laboratory) Mastering Magnetism

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