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JULY 2019 I SMT007 MAGAZINE 109 Reliability tests conducted for this study were temperature and humidity testing at 85°C/85% RH for 300 hours, and thermal cycling test for 300 cycles in the temperature range of -40– 85°C. Tables 4 and 5 show the pull test results of wire bonds made on nodules after tempera- ture and humidity testing and thermal cycling test, respectively. Note that wire bonds made in this study were using the SSB process. Test results in this study would likely be different if a standard gold bonding process or aluminum wedge bonding process had been used. Table 3: Pull test results of wire bonds made on scratches before reliability tests. Table 4: Pull test results of wire bonds made on nodules after temperature/humidity test. Table 5: Pull test results of wire bonds made on nodules after thermal cycling test.