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Our next generation filling process is designed for vertical conveyorised systems with insoluble anodes. It offers much improved filling performance and a wider working window compared to older generation products. By filling at lower surface thickness InPro ® MVF2 enables cost saving potential and allows for finer resolution. The new process is applicable for next generation HDI BMV filling and also for half-filling in Flex application. A/dm² applicable current density atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com InPro ® MVF2 BMV filling with dimple < 5 μm and surface copper 12 μm Over 70% throwing power in through holes with AR 6.4:1 Advanced BMV fi lling in ver cal conveyorized systems for HDI produc on Advanced HDI BMV fi lling 2 75 µm 100 µm 50 µm μm plated copper necessary for BMV filling (100×75 μm) 12