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H y b r i d L a s e r D r i l l i n g / C u t t i n g S y s t e m M D I M i c r o m i r r o r - D i g i t a l - I m a g i n g • C o s t - e f fi c i e n t & h i g h - q u a l i t y D D I • P h o t o h e a d s w i t h h i g h - p o w e r L E D s & D M D - t e c h n o l o g y • O p e r a t o r - f r i e n d l y c o n c e p t w / c o m p a c t f o o t p r i n t • C o m p a c t m o d u l a r d e s i g n o n a g r a n i t e b a s e • F l e x i b l e n u m b e r o f h e a d s a n d h e a d d i s t a n c e s f o r s h o r t e s t e x p o s u r e t i m e s • M u l t i p l e w a v e l e n g t h c o n c e p t • E v e n p r e s s u r e a c r o s s t h e p l a t e n s u r f a c e • S t a t e - o f - t h e - a r t h e a t i n g s y s t e m • A l l - s t e e l c o n s t r u c t i o n • M o d u l a r m a c h i n e c o n c e p t & fi e l d u p g r a d a b l e • U s e r - f r i e n d l y v i s u a l i z a t i o n s y s t e m • • A f f o r d a b l e i n i t i a l i n v e s t m e n t • M i c r o v i a d r i l l i n g 5 0 - 3 0 0 µ m d i a m e t e r • S p a c e s a v i n g c o m p a c t d e s i g n • B e s t p o w e r / s i z e r a t i o i n m a r k e t • P u l s e S t a b i l i z e r • E u r o p e a n t e c h n o l o g y c e n t e r a n d U S A s u p p o r t c e n t e r B ü r k l e N o r t h A m e r i c a s u p p l i e s a f u l l c o m p l e m e n t o f p r o d u c t i v e e q u i p m e n t f o r f a b r i c a t i n g p r i n t e d w i r i n g b o a r d s . F r o m i m a g i n g t h r o u g h m e t r o l o g y i n s p e c t i o n , B ü r k l e N o r t h A m e r i c a ' s e q u i p m e n t o f f e r i n g s e t s t h e s t a n d a r d i n t h e i n d u s t r y f o r I m a g i n g , R e g i s t r a t i o n , L a m i n a t i o n , M e c h a n i c a l o r L a s e r D r i l l / R o u t i n g a n d F e a t u r e M e t r o l o g y I n s p e c t i o n . V a c u u m L a m i n a t i o n S y s t e m Productive Fabrication Equipment w w w . b u r k l e a m e r i c a . c o m 1 1 1 0 5 K n o t t A v e . , C y p r e s s , C A 9 0 6 3 0

• PCB007 Magazine - July 2019
• Featured Content — Reliability
• Additional Content
• Column — Reliability…It All Comes Down to the Landing
• Feature — Microvias: Links of Faith Are Not Created Equally
• Short — A Tribute to Greg Beck
• Feature — Interconnect Reliability Correlation With System Design and Transportation Stress
• Feature Interview — How Changing Cleaning Technologies Affect Reliability
• Short — Building a Brain
• Column — What Do You Mean "Passed" Isn't Enough?
• Short — Establishing the Ultimate Limits of Quantum Communication Networks
• Feature — A Guide to High-reliability PCBs From Design to Specification
• Column — Moving Into Microvias, Part 4
• Electronics Industry News and Market Highlights
• Feature Interview — Avoiding CAF Failures at the IPC High-reliability Forum
• Feature Interview — A Conversation With Prototron's Van Chiem
• Short — New Interaction Between Thin-film Magnets for Faster Memory Devices
• MilAero007 Highlights
• Feature Column — When You Do Everything Right and Something Still Goes Wrong
• Short — Widening the Net
• Feature — How to Feed Test Data Back to Engineering for Process Improvement
• Feature Column — Avoid Failures in PCB Production With Compliance Control
• Supplier Highlights
• Feature Interview — Focusing on Surface Sensitivity for Reliability
• Column — Sunday Afternoon in Dongguan
• Short — Denny Fritz: The Difference Between Quality and Reliability
• Top 10 Editor Picks from PCB007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information