PCB007 Magazine


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4 PCB007 MAGAZINE I AUGUST 2019 AUGUST 2019 • FEATURED CONTENT In this issue, we explore plating, including the chemistries and processes that make up traditional subtractive etch and plate. We also investigate the confluence of smaller dimensions, reduced pollu- tion, higher throughput, and improved reliability as they relate to wet processes and plating. Further, we address some of the emerging processes for higher-performance designs and new equipment to implement modern techniques. Wet Processes & Plating The State of Plating by Marc Ladle Chemcut: Wet Processing Equipment for the Long Haul Interview with Rick Lies and Jerry Reitz Putting Green Into a Brownfield Facility Interview with George Milad The Advantages of Non-sludge Acid Copper Products Interview with Mike Wood Pollution Prevention Techniques: Rinse Water Reduction by Peter Moleux with contributions from Happy Holden 10 20 28 36 44 20 10

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