Our next generation filling process is designed for vertical conveyorised
systems with insoluble anodes. It offers much improved filling performance
and a wider working window compared to older generation products.
By filling at lower surface thickness InPro
®
MVF2 enables cost saving
potential and allows for finer resolution. The new process is applicable
for next generation HDI BMV filling and also for half-filling in Flex application.
A/dm² applicable
current density
atotech.com Global head office
Atotech Group
+49 30 349850
info@atotech.com
InPro
®
MVF2
BMV filling with dimple < 5 μm
and surface copper 12 μm
Over 70% throwing power in
through holes with AR 6.4:1
Advanced BMV fi lling in
ver cal conveyorized systems
for HDI produc on
Advanced HDI BMV fi lling
2
75 µm
100 µm
50 µm
μm plated copper necessary
for BMV filling (100×75 μm)
12
