SMT007 Magazine

A Siemens Business

• SMT007 Magazine - September 2019
• Featured Content — Industry Standards
• Additional Content
• Column — Rules or Recommendations?
• Short — Electronic Chip Mimics the Brain to Make Memories in a Flash
• Feature Interview — To Improve the Standards Process, Get Involved
• Feature Interview — The Convergence: IPC Merging CFX With IPC-2581
• Feature Interview — The Long Road to a New Standard
• Feature — Standards Through Time: Changing to Stay the Same
• Feature Column — Reliability by the Book
• Short — Photovoltaic Technology to Power Synaptic- and Neuronal-like Devices
• Feature Interview — The Ecosystem of Industry Standards
• Short — How Electronic Skin Could Help People With Disabilities
• Electronics Industry News and Market Highlights
• Column — Recognizing the Need For Change
• Short — New Type of Electrolyte Could Enhance Supercapacitor Performance
• Feature Column — How Standards Impact You and Your Company
• MilAero007 Highlights
• Feature — Explaining the QSFP-DD Data Center Interconnect Standard
• Short — Development of Flexible Sensors Mimicking Human Finger Skin by DGIST
• Column — Transform Your Operations With Nadcap
• Supplier Highlights
• Article — Comparing Soldering Results of ENIG and EPIG Post-steam Exposure
• Column — Process Methods for Reworking High Lead Count SMT Parts
• Top 10 Editor's Picks from SMT007.com
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information