86 SMT007 MAGAZINE I SEPTEMBER 2019
Advancement of SPI Tools to Support
Industry 4.0 and Package Scaling
E
This paper evaluates the current state of inline
SPI tools from multiple vendors for solder paste
measurement accuracy and capability. It dis-
cusses a measurement capability analysis that
was carried out against a golden metrology tool
across a range of volume deposits and high-
lights the results from the study.
Operational Excellence: Becoming the
Preferred Supplier, Phase 3—Re-engineer
Your Quality System
E
The final phase of becoming a preferred sup-
plier is to apply a business process re-engi-
neer approach to your quality system. Before
you start with this phase, the company should
have implemented the first two phases, which
are focused on changing its leadership mental-
ity to embrace LEAN Six Sigma and the pillars
of operational excellence.
Altus' Axis: Is Your Soldering System
Smart Enough for the Future?
E
Time and time again, we read about the impor-
tance of changing processes to work with
Industry 4.0, IoT, and smart manufacturing.
We all know how important having the cor-
rect systems in place is, but are we implement-
ing the necessary processes required to future-
proof our factories?
Optimizing Solder Paste Volume for Low-
temperature Reflow of BGA Packages
E
This article explains how the volume of low-
melting-point alloy paste—which delivers the
optimum proportion of retained ball alloy for
a particular reflow temperature—can be deter-
mined by reference to the phase diagrams of
the ball and paste alloys.
Goepel electronic Adds Solder Paste
and Placement Inspection
E
Goepel electronic has enhanced the capa-
bilities of its 3D AOI systems Basic Line·3D
and Vario Line·3D with the addition of com-
plete solder paste inspection function as well
as placement control before the soldering pro-
cess, making the system more flexible.
Recent Advances in X-ray Technology:
SMTA Webinar Recap
E
Technical Editor Pete Starkey recently attended
a webinar on advances in X-ray technology
and its applications in the electronics industry,
as presented by Keith Bryant, Chair of SMTA
Europe, on behalf of SMTA India. Here are the
highlights of the webinar.
BESTProto Adds Third Proto Line
With Mycronic
E
BESTProto Inc. has strengthened its assembly
capability with the acquisition and installation
of a new Mycronic MY-300 pick-and-place line.
New Microcare Cleaner Joins Ellsworth
Adhesives Europe Portfolio
E
The versatile Microcare General Purpose
Cleaner and Adhesive Remover, which replaces
the discontinued Slow Drying Flux remover
(MCC-E7M), is now available to order from
Ellsworth Adhesives Europe.
H K Wentworth Names New
Commercial Director
E
H K Wentworth, the parent company of Elec-
trolube and AF International, has appointed
Robert Crosby-Clarke to the board of directors
as commercial director.
