Issue link: https://iconnect007.uberflip.com/i/1163814
56 DESIGN007 MAGAZINE I SEPTEMBER 2019 Believe it or not, this is my 100 th "Beyond Design" column. The editors at I-Connect007 are a great group to work with. I eagerly await each month's magazine release to see how cre- ative the team have been with editing, laying out, and producing my column. I-Connect007 was founded in 1999 and is now the industry's longest-running electronics media portal. Personal development and con- tinued education are so important—especially in a relatively new and ever-changing industry where designers are continually pushing the envelope. And with its line-up of three online magazines—Design007 (featuring Flex007), PCB007, and SMT007—I-Connect007 provides the latest information from industry experts. My first "Beyond Design" column on ground pours was published online in 2011 [1] . Over the years, I think that I only missed publish- ing one month when I was on vacation. I'll have to work on that lazy streak! When I was first approached to write a regular column, I thought that I might be able to convert my course on advanced design for SMT, which I had been presenting throughout Australia and New Zealand since 1994, into a number of seg- ments. However, I never envisaged reaching the 100 mark. "Beyond Design" focuses on high-speed PCB design, signal and power integrity, and EMC design techniques. To wrap-up my 100 th col- umn, I look back over the past 99 columns and reflect on what I believe to be the Top 10 most enlightening for high-speed PCB designers, counting down in reverse order of preference. 10. The Dumping Ground Ground planes in a multilayer PCB allow the designer to ground anything, anywhere, without having to run multiple tracks, the net My 100 th Column Beyond Design by Barry Olney, IN-CIRCUIT DESIGN PTY LTD / AUSTRALIA