2 µm
atotech.com Global head office
Atotech Group
+49 30 349850
info@atotech.com
CupraEtch
®
SR8000
Dryfilm and soldermask pretreatment
with advanced adhesion performance
Excellent dryfilm and
soldermask adhesion
CupraEtch
®
SR8000 is a cupric chloride based microetching system with
unique additives. The simple three step process creates uniform roughening
of surface at low temperatures. Atotech's cost-effective pretreatment easily
drops into existing lines and reliably improves the adhesion of all copper
types to industry standard dryfilm and soldermask types. Metal complex
free solution benefits in cost-effective waste water treatment.
Pic. 1: CupraEtch
®
SR8000 etched Cu
Metal complex free
solution