Issue link: https://iconnect007.uberflip.com/i/1181966
NOVEMBER 2019 I SMT007 MAGAZINE 85 Figure 5: Reflow profile of a 93-mil board. Figure 6: Reflow profile of a 110-mil board. Table 4: Reflow parameters. Reflow Profiles A summary of the reflow profiles parame- ter ranges measured at 12 different locations for each board thickness is shown in Table 4. The reflow oven parameters (i.e., zone tem- perature, conveyor speed) were adjusted such that the reflow parameters for QFN compo- nents were highly comparable regardless of the board thickness (Figures 5–7). In this case, profiling for different thickness boards was not challenging since the boards are populated on one side only.