Issue link: https://iconnect007.uberflip.com/i/1181966
90 SMT007 MAGAZINE I NOVEMBER 2019 paste with any of the vias placed in the ther- mal pad. The red dotted line adjacent to the reference line was introduced to indicate that the solder area overlaps with the solder mask doughnut around the via but does not overlap with the via landing (red dotted reference line at the far right side of the graph). Figures 11 and 12 show the solder paste area distributions for reference designators that do not have the solder mask doughnut around each via in the thermal pad. These paste depos- its also appear to not intersect the via similar to the distributions in Figures 9 and 10. Any solder paste that would wick in the via after component placement and reflow would not be the direct result of the solder printed too close to the via or the via landing when Sten- cil A is used. Figure 11: Thermal pad solder paste area distribution/single dot paste deposit; 5 x 5 via array. Figure 12: Thermal pad solder paste area distribution/single dot paste deposit; 8x8 via array.