82 DESIGN007 MAGAZINE I DECEMBER 2019
EPTE Newsletter: Monocoque Printed
Circuits—An Update E
Wiring with flexible circuits could be a prac-
tical solution. Nowadays, most mobile device
manufacturers are consuming huge amounts
of thin, flexible circuits to attach on the sur-
face of the housing in limited spaces. Howev-
er, the cost of flexible circuits and assembling
them is another headache for device manufac-
turers because they are not negligible in the
whole cost of the devices.
Nano Dimension's Partner, Accucode,
Expands With First 3D Electronics Service
Bureau and Second DragonFly System E
Nano Dimension Ltd., a leading additive elec-
tronics provider, announced today that U.S.-
based reseller, Accucode, is opening the
world's first service bureau for 3D printing of
electronics focused on serving the market with
end-to-end prototyping and low-volume addi-
tive manufacturing services for electronics.
Insulectro Leverages One Source
Distribution for Printed Electronic
Materials at IDTechEx E
Insulectro, the largest distributor of PCB and
printed electronics materials, exhibited at
IDTECHEX's Printed Electronics World 2019
conference held in Santa Clara, California.
AstroNova Partners With SPF
for Flex Tech E
AstroNova has partnered with SPF, a technical
consultancy supporting printing and packag-
ing industries to facilitate an easy, cost-effec-
tive digital printing method for producing flex-
ible circuits by combining AstroNova's Quick-
Label and SPF's metallograph technologies.
Mentor Video: What You Need to Know
About Rigid-Flex Design E
This on-demand webinar will show you how
PADS Professional's rigid-flex technology sim-
plifies the rigid-flex design process, from stack-
up definition through to manufacturing hand-
off. The presenters are Technical Marketing En-
gineering Manager John McMillan and Techni-
cal Marketing Engineer Brent Klingforth, both
of Mentor, a Siemens business.
Decreasing Bend Radius and Improving
Reliability, Part II E
Many of the issues that arise when using a flex
circuit come from a lack of knowledge about
how to properly design one, especially when
the circuit is required to bend. Many novices
will design a circuit that calls for bending the
flex in too tight of a bend radius, which can
cause damage to the circuit and lower the re-
liability of the end product. This series of arti-
cles will focus on the seven key aspects to con-
sider when designing for maximum durability
and maximum flexibility.
Flex Talk: Additive Electronics
Momentum E
Tara Dunn has been involved with additive
electronics for the past several years and seen
the discussion of and demand for sub-75-mi-
cron feature sizes slowly grow. Conversations,
questions, and research about SAP and mSAP
increased significantly when it was announced
that the mSAP process was used to create the
circuitry in the more recent versions of our
smartphones. While this process is available in
very high volume in some areas of the world,
it is still in the early stages of development in
other areas.
