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4 SMT007 MAGAZINE I FEBRUARY 2020 While this issue may be about finer pitches in manufacturing and packaging, to successfully manu- facture circuit boards in this time of shrinking components and board features, the secret is to ensure success with the solder joints. Manufacturers will need the tools, options, and human expertise to succeed at this level. Fine Pitch Evolving Solder Capabilities for Shrinking Components Interview with Yuya Suzuki Increased Miniaturization Poses Soldering Challenges Interview with Chris Nash FEATURE COLUMNS: Big Trouble Comes in Tiny Packages by Eric Camden Size Matters: The Digital Twin Michael Ford Semiconductors in Charge: The Changing Face of PCB Manufacturing Interview with Chuck Bauer and Dana Korf What's Driving AOI Innovation and Collaboration? by Brent Fischthal The Big Picture on Small Components Interview with Ray Prasad LPKF on Stencils and Depaneling Interview with Stephan Schmidt and Mirela Orlowski 58 78 36 52 10 20 28 40 FEBRUARY 2020 • FEATURED CONTENT 10 20 78 28 58 52 40 36

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