Issue link: https://iconnect007.uberflip.com/i/1207026
62 SMT007 MAGAZINE I FEBRUARY 2020 There's some work being done on additive manufacturing, not only of the circuits but also of the passive components and being able to additively manufacture dielectric conductor resistors and capacitors. It's interesting. I'm wondering whether those are going to be com- ponents, or is it going to be the entire device? It's something we probably won't know some years yet. Suzuki: Right. That's why we have a lot of SiP research and development in a variety of com- panies. Johnson: As the tolerances become so tight, do you foresee a point where solder mask will need to be so precise in terms of registration that another technology will need to be deployed? Suzuki: One answer, as a solder resist maker, is high resolution. Again, high resolution always gives you better tolerance in terms of the pat- tern and size. Another direction is positional accuracy, which depends on the tool and how well they can compensate for the location of the original design versus the real panel. Cooperation between the material makers, like Taiyo, and the tool makers is very critical. Johnson: The challenge is not with your prod- uct but with the equipment being used. Suzuki: Exactly. Both approaches need to be taken. Johnson: And that comes down to mechanical characteristics like stepper motor granularity and such. Suzuki: Correct. The positional accuracy of the PCB itself has a lot of impact on that, too. Other than the solder resist, the PCB has a great impact. Johnson: That makes sense. Thank you very much for your time. Suzuki: Thank you for the invitation. SMT007 Highly Accelerated Thermal Shock (HATS™) High-speed Via Reliability test systems have now been updated with HATS 2 ™ technology. These updates provide HATS™ test systems with a wider temperature range (-55°C to 265°C), an improved measurement subsystem capable of high- current, micro-ohm precision, 4-wire resistance mea- surements and the ability to perform multiple cycle con- vection oven reflow simulation with in-situ resistance mea- surements in accordance with IPC-TM-650 Method 2.6.27B. This update also allows HATS™ test systems to test up to 72 IPC-2221B Type "D" coupons and 36 traditional HATS™ or new HATS 2 ™ single via cou- pons for both multiple cycle convection oven reflow sim- ulation and thermal shock/ cycling. The patented HATS 2 ™ single via test coupon con- tains 7 single via nets. Each of these single via nets can be replaced by a daisy-chain net. This allows an updated HATS™ unit to collect electrical resistance data from both single via and daisy-chain test nets for the via structures on the coupons. According to Bob Neves, Microtek Laboratories China CTO/chairman, "Designers can include 1 or 2 daisy-chain nets along with 5-6 single via nets on the same HATS 2 ™ single via test coupon. This should pro- vide a bridge between tradi- tional daisy-chain and single via net test results." For more information about HATS 2 technology or the pat- ented HATS 2 ™ single via test coupon, please visit HATS- Tester.com. High-speed Via Reliability Testing Using Updated HATS 2 Technology