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94 SMT007 MAGAZINE I FEBRUARY 2020 Article by Vern Solberg CONSULTANT Embedding components within the circuit board structure has evolved from the more basic and mature passive component integra- tion to more complex process methodologies developed for embedding new generations of very sophisticated semiconductors. While tech- niques developed for embedding and terminat- ing the semiconductor within the circuit struc- ture have not reached universal acceptance, progress in developing high-volume manufac- turing capability for performance-critical appli- cations has accelerated throughout the high- end technical community. The decision to embed components within the multilayer printed circuit board or package substrate structure must be reinforced with a compelling need to improve product perfor- mance, minimize product size, or meet strin- gent operating environmental concerns. Com- panies have found that embedding components is not a trivial endeavor and should include a strong and reliable support group of experi- enced suppliers. This is because there will be a significant amount of preparation required when embedding the semiconductor element into the layer structure of the circuit board or package substrate. The developer must first determine the most efficient method for the electrical interface of the die element. For example, the initial semi- conductor fabrication process commonly fur- nishes an aluminum bond pad that is compat- ible with traditional gold wire-bond interface processing. However, when alternative direct surface interface methods are required, the semiconductor terminals must be furnished with an alternative alloy that is compliant with the selected attachment material or interface method. Furthermore, with larger and high I/O semi- conductors, it is often necessary to add metal- lization onto the die surface to accommodate the redistribution for the closely spaced periph- erally located terminal sites to a wider-spaced and more uniform row and column, array pat- tern. The separation of the array pattern con- figured terminals will better accommodate cir- cuit routing efficiency. There are a number of methods successfully utilized for interconnecting the uncased semi- conductor components. Some processes have Embedding Semiconductors

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