PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/1221561

Contents of this Issue


Page 32 of 119

MARCH 2020 I PCB007 MAGAZINE 33 Full Steam Ahead Leading-edge direct metallization process lines like the Blackhole Advanced Direct Metal- lization are now in mass production for mSAP with 3 µm Cu foil layups. These systems utilize controlled etch equipment configurations in mass production. Qualification testing on 12L anylayer panels processed with this equipment configuration passes IST testing through 300 cycles. In these designs, advanced direct metallization processing was done on anylayers L2-10 and mSAP L3-11. These designs have microvia hole sizes of 80–100 x 45 µm with approximately 2 million interconnects per panel. The presence of any carbon residues is checked with AOI, and currently, zero defects have been detected on 5,000 PSM/month of production for this process. The electrolytic plating for these production boards is done on VCP lines with panel plating on the core through anylayers and pattern plating on the mSAP buildup layer. The electron backscatter diffraction (EBSD) image in Figure 6 shows the uniformity of the grain size at the interface between the target pad and electrolytic copper plating. Summary As miniaturization has driven components to smaller packages with higher pin counts, PCB substrates have evolved to meet the challenge of increased connection density. The micro- via has become synonymous with HDI design. As the change in PCB design progressed from through-hole to HDI designs like anylayer and mSAP technologies, direct metallization tech- nologies have made advancements in chemis- try and equipment configurations to keep pace with the industry. The leading-edge, advanced direct metalli- zation systems currently in production today are providing PCB fabricators of the latest gen- eration mobile interconnection platforms the reliability and performance needed to compete. In new segments, such as those that utilize flexible and rigid-flex circuits or new hybrid materials, carbon direct metallization offers a cost-effective and technology-enabling so- lution for fabricators looking to expand their metallization capacity. PCB007 Graham Lee: Process Specialist—Metallization David Chun: Equipment Manager—Asia Albert Tseng: Product Manager—Asia Charles Bae: GDAC Leader—Korea Smith Han: Technical Service Manager Jordan Kologe: Technical Marketing Specialist Bill Bowerman: Product Director—Primary Metallization Figure 6: EBSD grain structure of via and target pad cross-section. Panel pre-conditioned at 260°C, followed by 300 cycles at 170°C. The average grain size is 3.12 microns. Graham Lee Smith Han David Chun Jordan Kologe Albert Tseng Charles Bae Bill Bowerman

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Mar2020