Issue link: https://iconnect007.uberflip.com/i/1228683
APRIL 2020 I SMT007 MAGAZINE 51 Example critical gaps that could significant- ly impact the progress of the deployment and adoption of smart manufacturing are: • Undefined data security between vertical segments • Lack of machine interface standardization for data flow • Undefined data formats for data flow • Data vulnerability when security is breached • Robust and scalable connectivity architec- ture across electronics vertical segments to enabling smart manufacturing function- ality (event and alarm notification, data variable collection, recipe management, remote control, adjustment of settings, interfacing with operators, etc.) Summary The iNEMI Smart Manufacturing Roadmap Chapter provides the situation analysis and key attribute needs for the horizontal topics within the vertical segments as well as between the vertical segments. Also, the chapter identifies the primary gaps and needs for the horizontal topics that must be addressed to enable the re- alization of smart manufacturing: • Definitions: Smart manufacturing, smart factory, Industry 4.0, AI, ML, etc. • Audits for smart manufacturing readiness: Develop consensus-based documentation, leverage published documents (e.g., Singapore Readiness Index [12] ) • Security: Best practices, physical, digital, local and remote access, etc. • Equipment diversity and data flow communications: Old, new, and mixture • Data attribute categorization and prioriti- zation: Volume, velocity, variety, veracity, and value • Cost versus risk profile versus ROI • Talent pool (subject-matter experts): Data and computer scientists, manufacturing engineers, and automation • Standards and guidelines: Data formats and structures, communication protocols, and data retention • Open collaboration: SEMATECH 2.0 The gaps and needs that were identified for addressing require additional detail for the sta- tus of the different vertical segments to ap- propriately structure the initiatives. It was suggested to circulate surveys to gather the in- formation to appreciate the issue. One survey format was suggested as an example template: Manufacturing Data Security Survey for IRDS FI Roadmap [13] . iNEMI, together with other organizations, such as SEMI, can organize workshops to fa- cilitate collaboration between the electronics manufacturing industry stakeholders. In addi- tion, iNEMI can establish cross-industry col- laborative projects that can develop the en- abling technologies to address the roadmap identified needs and gaps to realize smart manufacturing. Further, organizations, such as iNEMI and SEMI, can collaborate to establish guidelines and standards (e.g., data flow interfaces and data formats) as well as lead groups to devel- op standards for equipment and tool hardware to reduce complexity during manufacturing. Also, iNEMI can engage other industry groups to foster the exchange of best practices and key knowledge from smart manufacturing ini- tiatives. The members of the roadmap TWG are com- mitted to provide guidance during the smart manufacturing journey—people, processes, and technologies. Members of the TWG also suggested engaging microelectronics groups as well as non-microelectronics groups to assess iNEMI, together with other organizations, such as SEMI, can organize workshops to facilitate collaboration between the electronics manufacturing industry stakeholders.