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60 PCB007 MAGAZINE I JUNE 2020 ESA Approval for Ventec VT-901 Material in ACB Belgium Rigid and Flex-Rigid Production E Ventec International Group Co. Ltd. is pleased to announce that its VT-901 polyimide material is now fully qualified by ESA in ACB Belgium's manufacturing process for rigid and rigid-flex polyimide PCBs and HDI PCBs. Raytheon Technologies Supporting the Supply Chain E To support its small business suppliers, Ray- theon Technologies formed a Small Business Supplier Stimulus Team focused on coordinat- ing support to its supply base. This team brings together cross-functional members from each of the company's businesses, creating a hub of knowledge, expertise, and experience. Atotech to Present at the ECTC Virtual Conference 2020 E Atotech, a leading global provider of electro- plating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging, and dual-damascene applications, will participate in this year's IEEE 70 th Elec- tronic Components and Technology Conference (ECTC). The virtual conference will be held in June. MacDermid Alpha Releases Complete Semi-Additive Process for IC Substrates and Panel-Level Packaging: Systek SAP E MacDermid Alpha Electronics Solutions, a glob- al leader in specialty materials for electronics, announces the release of Systek SAP. The Mac- Dermid Alpha Systek SAP is a family of high- performance build-up processes for IC sub- strate RDL that provide multiple process flows for different materials as well as revolutionary technology innovations in the desmear, condi- tioning, activation, and metallization steps. Rogers Corporation Keeps Materials Moving E The I-Connect007 editorial team spoke with Roger Tushingham of Rogers Corporation about the company's current priorities with every- thing that's been changing recently, including his perspective on the distributing and manu- facturing trends he sees as a global supplier. Language of Electronics: HENSOLDT and Nano Dimension Achieve Breakthrough in Electronics 3D Printing E Sensor solutions provider HENSOLDT, togeth- er with additively manufactured electronics/ printed electronics provider Nano Dimension, has achieved a major breakthrough on its way to utilizing 3D printing in the development process of high-performance electronics com- ponents. Key Considerations for Your Next Direct Imaging System E In this column, Orbotech West DI expert Rick Jackson provides a guide detailing which is- sues should be considered when choosing a new DI system. As your PCB manufacturing company considers a new DI system, here are some key considerations to keep in mind. Elsyca Offers Free White Paper on How Plating Simulation Raises Yield and Profitability E What if the PCB pre-production engineer could upfront identify problem areas for the pattern plating and apply auto-intelligent copper bal- ancing, as part of the CAM process to provide a right-first-time panel layout for production?

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