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atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com Horizon ® BondFilm & BondFilm ® EX Horizontal equipment and process solu on for bonding enhancement Pic. 1: Automation, process control and thin panel transport Pic. 2: Superior etch rate stability and coverage Best process controls and low signal loss with high frequency applica ons Pic. 3: Roughened, brown organo-metallic surface after BondFilm ® BondFilm ® EX is an advanced replacement for conventional bonding enhancement solutions, offering enhanced performance with minimal copper removal and therewith a smooth copper interface desired for high frequency applications. The Horizon ® BondFilm equipment provides VCS for control and traceability, superior process stability with a proprietary feed and bleed system, as well as a precise dosing system. It is designed for reducing water and energy consumption. The combination of next generation Bonding En- hancement chemistry together with market leading equipment design gives the best solution for inner layer bonding needs.

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