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86 PCB007 MAGAZINE I SEPTEMBER 2020 RBP Releases Circutek CC-720 PTH Acid Cleaner Conditioner E Circutek CC-720™ is an acidic cleaner/condi- tioner for use in the electroless copper metal- lization process in the PCB industry. It is for- mulated to remove fingerprints, light soil, and other contaminants from copper foil. Frontline Launches InShop Data Analysis Software E Frontline, a software PCB solutions subsidiary of Orbotech, launched InShop®, a new Industry 4.0 software solution for PCB manufacturers. InShop will provide PCB manufacturers with a fast and insightful analysis of data from across the production floor to monitor operations and detect anomalies in near real-time. Limata's Innovative LUVIR Technology Speeds up PCB Solder Mask Production E Limata, a provider of laser direct imaging systems for PCB manufacturing and adjacent markets, announced the availability of its proprietary and field-proven LUVIR Technology® on all X-series model types. This unique LDI technology signifi- cantly increases the speed of solder mask direct imaging at a lower total cost of ownership (TCO). Nova Drilling and Fabrication Expands Capabilities With Excellon Laser Systems E Nova Drilling and Fabrication Services based in Milpitas, California, expands laser capabilities with the addition of two COBRA-II Hybrid UV and CO2 laser systems from Excellon. Atotech Expands Its Software Capabilities E Atotech, a global provider of specialty surface- finishing solutions, announced it signed a de- finitive agreement to acquire Visutech Plating, along with certain assets from its partner com- pany, koenig-pa GmbH. MacDermid Alpha Releases Systek ETS 1200 Pattern Plating Metallization for Embedded Trace Substrates E MacDermid Alpha Electronics Solutions, a global leader in specialty materials for elec- tronics, announced the release of Systek ETS 1200, the latest addition to the Systek family of IC substrate manufacturing solutions. Hitachi Chemical Launches Mass Production of 5G-Compatible Printed Wiring Board Material E Hitachi Chemical Co. Ltd. launched mass pro- duction of "MCL-HS200," an advanced func- tional laminate material for printed wiring boards, with low transmission loss and low warpage properties required for semiconduc- tor packaging substrates used in such fields as fifth-generation mobile communications systems (5G), advanced driver-assistance sys- tems (ADAS)*1, and artificial intelligence in March. Rogers Introduces RO4450T Glass-Reinforced Thermoset Multi-Thickness Bondply E Wireless circuit designers can now enjoy a true breakthrough with Rogers Corporation's RO4450T™ bondply. This product offers design- ers a spread glass-reinforced bonding material in seven thickness options ranging between 0.0025" (0.064mm) and 0.006" (0.152mm), greatly improving flexibility for high multilayer board count designs. Seacole Specialty Chemical Installs Rooftop Solar Array E Seacole Specialty Chemical activated its new 200 megawatt-hour rooftop solar array at its corporate offices in Plymouth, Minnesota.

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