PCB007 Magazine

PCB007-Sept2020

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SEPTEMBER 2020 I PCB007 MAGAZINE 107 Figure 3: Two sets of three-level microvias, left-stacked, thermal cycled to reflow temps, opened, and then closed when cooled. Right-staggered and no-open/resealed connections. (Source: Motorola Solutions) Figure 4: Mechanical intergranular fractures of stacked microvias. (Source: Raytheon)

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