Issue link: https://iconnect007.uberflip.com/i/1293772
46 SMT007 MAGAZINE I OCTOBER 2020 to introducing not only 28-, 20-, and 14-nanometer technologies, but even seven-nanometer technology. TSMC just had their technology sympo- sium last week and talked about get- ting their seven-nanometer qualified for automotive applications. That's a big driver. There has been a lot of talk about advanced communica- tions and 5G coming into cars. We're going to have to require all these data commu- nications with extremely low latency. In recent months, there has been some rethink- ing about that. However, a lot of the process- ing for autonomy and decision making really is going to be centered inside the car with a little less burden on the outgoing and incoming com- munications; it's still going to be an important part of the overall architecture. Then, there are high levels of reliability on all components. The sensors are changing, and the powertrain electri- fication, especially in high voltage management, is a big part of dealing with these power tran- sistors. On the processor roadmap, you can see some of these as you look out forward in the 5-, 10-, and 15-year horizon. Part of the HIR road- map is we want to go out 15 years and get out into the pre-competitive area to set some vision for what people need to develop. Typically, we see wire bond and some flip- chip today, such as flip-chip with the heat spreader and automotive applications. As we go forward, there's going to be a lot of SIP or multi-chip integration. There's also going to be a very high-density integration platform that integrates these chips together that require high speed and high data interconnects between the chips, silicon interposer, etc. And then longer term, we even see the potential for optical I/O inside of these heavy-duty processors that go into these automotive applications. With the silicon nodes, we might even put seven-nano- meter over in the five- to seven-year horizon. Five-nanometer might go out because we see a huge acceleration in the use of silicon nodes inside the automotive applications. These are all the various different attributes of the interconnect inside the package that gets finer and finer as you go along. As you go out, there's more and more functional integration inside the package. Onto sensing technologies, there's a lot of different sensors, but if you take a look at all of these different types of sensors, they typically use four dif- ferent types of technology. Seam- less image sensors, radar sensors, or ultrasounds are very common for close quarters, like backup sensors and things like that in cars. We don't see much development going on in the ultrasound area, but we do see a lot of development going on in these first three. Our first chapter included LiDAR. We just mentioned radar and camera, but we've had a pretty significant contribution to radar. Our next update is going to include radar and a more extensive discussion on the camera side of things. On the reliability side, that is an overreach- ing thing for automotive applications; some- times, it changes the physical architecture of a package if you compare it to lower reliability requirements for cellphones or laptops. This section was contributed by our friends from Bosch; they had a lot of good inputs on various different attributes of how you designed for reliability, including much more extensive use requirements of FMEA, physics of failure, and even things like data fusion for health assess- ments and then digital twins. A lot of that reli- ability had to do with upfront modeling and analysis of what you're designing before you even make something physical out of it. On the electrification side, there are a lot of different applications. I referred to that before—things as simple as compressors and electric steering. There are very high voltages used for the drive motors, but then there are intermediate voltages, like 48 volts, used for a lot of the other circuitry and smaller motors inside the car. When you deal with conversion, you need converters and PCB technology to platform all of that. As you get up into the higher kilo- watt areas, you have a hybrid electric inverter and the fully electric drive motors for elec- tric vehicles. We make the statement that the primary impact will be on batteries because Rich Rice