SMT007 Magazine

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• SMT007 Magazine — October 2020
• Featured Content — Technology Roadmaps
• Additional Content
• Column — Roadmaps: Driving Into the Future
• Column — Joint Industry Standard IPC J-STD-006: Electronic Solder Alloys, Part 2
• Feature Interview — IEEE's Heterogeneous Integration Roadmap, Part 1
• Video Short — Real Time with… SMTAI: Aegis Software
• Feature Interview — How the HIR Impacts Design Through Assembly
• Short — Lean Digital Thread: DFM Is Now as Easy as Spellcheck
• Feature Interview — The Aerospace and Defense Chapter of the HIR
• Feature — The Heterogeneous Integration Roadmap for Aerospace and Defense
• MilAero007 Highlights
• Feature Interview — The HIT Hits the Road With the Automotive TWG
• Interview — Monsoon Solutions: Achieve Greatest Reliability With Optimized Panelization, Part 2
• Video Short — Real Time with… SMTAI: Insituware
• Article — Reducing Flux Splatter in Sensors and Camera Modules
• Video Short — Real Time with… SMTAI: KYZEN
• Electronics Industry News and Market Highlights
• Interview — Programs for Veterans: A Blackfox Update
• Short — New Electronic Skin Can React to Pain Like Human Skin
• Supplier Highlights
• Column — What's Lurking in the Shadows?
• Column — Process Effectiveness Qualification
• Top 10 Editor's Picks from SMT007.com
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead